The TRAK series plasma system delivers superior plasma treatment quality and automation in one very configurable platform, resulting in high-throughput plasma processing and plasma cleaning for semiconductor and electronics packaging. The plasma chamber is capable of processes such as dielectric etch, photoresist descum/ash, oxide removal, organic contamination clean and surface activation, depending upon chamber kit and electrode configuration.
TRAK systems support manual and automated operations (with inline or built-in handler), SMEMA and SECS/GEM communications protocol, and remote user interface. The versatile, exceptionally uniform, and compact chamber design allows for interchangeable processing configurations and plasma modes - direct, RIE, downstream, and IFP (ion-free plasma) plasma treatment options.
A three-axis symmetrical plasma chamber ensures that all positions of the product are treated uniformly while tight controls over all process parameters ensure repeatable results from product to product.
The TRAK's small plasma chamber volume and proprietary plasma process control enable unmatched short cycle times, while its slim structure minimizes floor space requirements.
The TRAK's universal architecture handles a wide variety of product form factors, including boats, carriers, Jedec/Auerboats, strips, laminates, and wafers.
Depending on throughput and product form requirements, the system can be configured for magazine-to-magazine processing of single and multiple strips or lead frames, wafer processing, and standalone for island-based production environments.
The TRAK's SMARTTune management system provides closed-loop plasma control that optimizes the RF system and minimizes tuning time. The system automatically recycles to a plasma-ready state, compensating for changes in vacuum pressure, temperature and varied lot sizes. Maximum power to the chamber is achieved in seconds with a proprietary algorithm that constantly measures forward and reflective power inside the chamber.
Superior Plasma Process Quality and Automation in One System
The Nordson MARCH FlexTRAK platform provides unparalleled treatment uniformity and process consistency.
A three-axis symmetrical chamber ensures all positions of the product are treated uniformly, while tight controls over all process parameters ensure repeatable results from product to product.
High-Throughput Processing Capability
The FlexTRAK platform is a highly configurable, highthroughput plasma system. Its universal architecture accommodates a multitude of material handling configurations to support a wide assortment of variablesize form factors. Its small chamber volume andproprietary process control enable unmatched short cycle times, while its slim structure minimizes floor space requirements.
The FlexTRAK platform handles a wide variety of product form factors, including boats, carriers, Jedec/Auer boats, strips, laminates, and wafers. Depending on throughput and product form requirements, the system can be configured for magazine-to-magazine processing of single and multiple strips or lead frames, wafer processing, and standalone for island-based production environments.
SMART Tune Management System
The FlexTRAK platforms SMART Tune management system provides closed-loop plasma control that optimizes the RF system and minimizes tuning time. The system automatically recycles to a plasma-ready state, compensating for changes in vacuum pressure,temperature and varied lot sizes. Maximum power to the chamber is achieved in seconds with a proprietary algorithm that constantly measures forward and reflective power inside the chamber.
Features and Benefits
Ultimate application flexibility for direct, downstream and ion-free (patented) plasma, which allows treatment without exposure to ion and UV
Easily integrates with a variety of process equipment, including wire bond, die attach, dispense, mold, and marking
Slim structure that requires minimal floor space, all service components are easily accessible from the front
Compact, three-axis symmetrical chamber and proprietary process control for unmatched process uniformity
Industry leading throughput capacity with short cycle times
Specifications: FlexTRAK Plasma System
Dimensions
W x D x H Footprint 382W x 1210D x 1595H mm (2037H mm with light tower)
15W x 47.6D x 62.8H in. (80.2H in. with light tower)
Net Weight 275 kg (605 lbs)
Equipment Clearance Right, Left 153 mm (6 in), Front, Back 914 mm (36 in)
Chamber Maximum Volume 5.5 liters (338 in)
Electrodes Variable Electrode Configurations Power-Ground, Ground-Power; Power-Power
Working Area 305W x 305D mm (12W x 12D in.)
RF Power Standard Wattage 600 W
Frequency 13.56 MHz
Gas Control Available Flow Volumes 10, 25, 50, 100, 250 or 500 sccm
Maximum Number of MFCs 4
Control & Interface Software Control EPC with PC-Based Touch Screen Interface
Remote Interface SMEMA, SECS/GEM
Vacuum Pump
Standard Dry Pump 16 cfm
Optional Wet Pump 19.5 cfm
Optional Purged Dry Pump 16 cfm
N2 Purged Pump Flow 2 slm
Facilities
Power Supply 220 VAC, 15A, 50/60 Hz, 1-Phase, 12 AWG, 3-Wire
Process Gas Fitting Size & Type 6.35 mm (0.25 in.) OD Swagelok Tube
Process Gas Purity Lab or Electronic Grade
Process Gas Pressure 0.69 bar (10 psig) min. to 1.03 bar (15 psig) max., regulated
Purge Gas Fitting Size & Type 6.35 mm (0.25 in.) OD Swagelok Tube
Purge Gas Purity Lab or Electronic Grade N2/CDA
Purge Gas Pressure 2 bar (30 psig) min. to 6.9 bar (100 psig) max., regulated
Pneumatic Valves Fitting Size & Type 6.35 mm (0.25 in.) OD Swagelok Tube
Pneumatic Gas Purity CDA, Oil Free, Dewpoint 7C (45F), Particulate Size <5 m
Pneumatic Gas Pressure 3.45 bar (50 psig) min. to 6.89 bar (100 psig) max., regulated
Exhaust 25.4 mm (1 in.) OD Pipe Flange
Compliance SEMI S2/S8 (EH&S/Ergonomics)
International CE Marked
Ancillary Equipment
Gas Generators Nitrogen, Hydrogen
(Requires Additional Non-Optional Hardware)
Facilities Chiller, Scrubber
Additional Prep Fees May Apply
